To manufacture high-level full-automation die bonder and wire bonder that used in optical communications, optical storage, automotive, display applications, and high-power industrial laser diode porducts. The systems possess high-speed, micron-level, high-precision, high-stability, high-yield for mass production, and can be customized for special function of multiple packaging types on the same system.
Moreover, new developed Active Alignment die bonder with an advanced laser alignment system can optimize the optical power after coupled into optical fiber.
Application
TO-CAN, COC(chip on chip), COS(chip on submount), COB(chip on board) die bonding system, wire bonding system, active alignment die bonding system